Glass Substrates Enter Commercial AI Chip Production: 10x More Connections Per mm, 50% More Silicon Per Package, $1B to $4.4B Market by 2036

MIT Technology Review·low signal

South Korean company Absolics (SKC subsidiary) began commercial production of glass substrates for AI chip packages at its CHIPS Act-funded Covington, Georgia plant ($175M grant) — capacity for 2-3 million H100-sized chip packages per year. Glass enables 10x more connections per millimeter versus organic substrates, allows ~50% more silicon per package area, and is 5,000x smoother, reducing signal interference. Intel has functional test devices; Samsung, LG Innotek, and JNTC are scaling production. Market projected to grow from $1B in 2025 to $4.4B by 2036.