Samsung plans to lift HBM output to 250,000 wafers a month and make HBM4 80% of the mix

Seoul Economic Daily (en.sedaily.com), via Hacker News (495 points)·medium signalXBlueskyLinkedInCopy link

Samsung expects to expand HBM production from roughly 180,000 wafers monthly to about 250,000 next year, nearly 40% growth, with the HBM4 family going from around 40% of output this year to roughly 80% next. Mass-production HBM4 shipments on sixth-generation 1c DRAM began in February 2026, and 12-layer HBM4E samples went to customers including Nvidia in May 2026. Supporting that, glass carrier outsourcing goes from 20,000 to 50,000 sheets monthly, a 2.5x increase. The Hacker News thread took 495 points. This is the supply-side number behind every 2027 inference capacity projection.