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OpenAI Phone Hardware Specs Leak: MediaTek 2nm Chip, Dual NPU, 30M Units Projected for 2027
Leaked specifications for OpenAI's first 'AI agent phone' reveal a custom MediaTek Dimensity 9600 on TSMC's 2nm N2P node, LPDDR6 RAM, UFS 5.0 storage, dual NPU architecture, and an enhanced ISP for real-time environmental sensing. The device would bypass traditional app-based interaction in favor of AI agents executing tasks directly. Analysts project 30 million units across 2027-2028. Mass production targeted for H1 2027. 63 upvotes and 50 comments on r/ChatGPT — low score but high signal for a hardware leak.
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